From January 15-17, 2014, MacDermid exhi

From January 15-17, 2014, MacDermid exhibited their innovative chemistry at INTERNEPCON JAPAN 2014. This electronics R&D show attracted 83,000 visitors over 3 days from the Japanese automotive, consumer electronics, printed circuit board and integrated circuit packaging industries. MacDermid’s environmentally-friendly trivalent chromium technology was the center of much attention, along with our offerings for the molded interconnect device (MID) market. Blackhole, also on display, remains the default standard for flexible and rigid circuit boards. http://ow.ly/sSsQb http://ow.ly/i/4nefX http://ow.ly/i/4neg4

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From January 15-17, 2014, MacDermid exhi

From January 15-17, 2014, MacDermid exhibited their innovative chemistry at INTERNEPCON JAPAN 2014. This electronics R&D show attracted 83,000 visitors over 3 days from the Japanese automotive, consumer electronics, printed circuit board and integrated circuit packaging industries. MacDermid’s environmentally-friendly trivalent chromium technology was the center of much attention, along with our offerings for the molded interconnect device (MID) market. Blackhole, also on display, remains the default standard for flexible and rigid circuit boards. http://ow.ly/sSsQb http://ow.ly/i/4nefX http://ow.ly/i/4neg4

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